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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

化學(xué)成分 BZV55-B10

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司,安世半導(dǎo)體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息,恩智浦可以向我們的客戶提供相關(guān)資料,以協(xié)助他們進(jìn)行RoHS指令或無鉛狀態(tài)合規(guī)評估。客戶可以直接從一般產(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細(xì)的數(shù)據(jù),這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細(xì)資料請見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
933827750115BZV55-B10,115BZV55-B10SOD80C (LLDS)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 1303-86-2 at 77340 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 164208 ppm; substance 7439-92-1: <1 ppm; substance 7440-48-4: 2487 ppm; substance 1333-86-4: 121 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 164208 ppm; substance 7439-92-1: <1 ppm; substance 1303-86-2: 77340 ppm; substance 7440-48-4: 2487 ppm; substance 1333-86-4: 121 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 460 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
DieDoped siliconSilicon (Si)7440-21-30.03349566.9900000.095183
DieActive agentAntimony (Sb)7440-36-00.0000400.0800000.000114
DiePure metal layerTitanium (Ti)7440-32-60.0000650.1300000.000185
Die Metallization 1 Total0.0000650.1300000.000185
DiePure metal layerNickel (Ni)7440-02-00.0002100.4200000.000597
Die Metallization 2 Total0.0002100.4200000.000597
DiePure metal layerSilver (Ag)7440-22-40.01619032.3800000.046007
Die Metallization 3 Total0.01619032.3800000.046007
Die Total0.050000100.0000000.142086
Post-PlatingPure metal layerTin (Sn)7440-31-50.59991099.9850001.704774
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000360.0060000.000103
Post-PlatingImpurityBismuth (Bi)7440-69-90.0000300.0050000.000085
Post-PlatingImpurityLead (Pb)7439-92-10.0000240.0040000.000068
Post-Plating Total0.600000100.0000001.705030
Glass TubeOxide CeramicsSilica7631-86-98.33490049.00000023.685422
Glass TubeOxide CeramicsBoron oxide (B2O3)1303-86-22.72160016.0000007.734015
Glass TubeOxide CeramicsPotassium oxide (K2O)12136-45-71.3608008.0000003.867007
Glass TubeOxide CeramicsSodium monoxide12401-86-41.0206006.0000002.900256
Glass TubeOxide CeramicsZinc oxide (ZnO)1314-13-21.0206006.0000002.900256
Glass TubeOxide CeramicsTitanium oxide (TiO)12137-20-10.8505005.0000002.416880
Glass TubeOxide CeramicsAluminium trioxide (Al2O3)1344-28-10.6804004.0000001.933504
Glass TubeOxide CeramicsLithium oxide (Li2O)12057-24-80.6804004.0000001.933504
Glass TubeOxide CeramicsNon-declarable0.3402002.0000000.966752
Glass Tube Total17.010000100.00000048.337596
DumetIron-nickel alloyIron (Fe)7439-89-67.14583140.81000020.306425
DumetIron-nickel alloyNickel (Ni)7440-02-05.77830033.00000016.420290
DumetIron-nickel alloyCopper (Cu)7440-50-84.02730023.00000011.444444
DumetIron-nickel alloyManganese (Mn)7439-96-50.2101201.2000000.597101
DumetIron-nickel alloyCopper oxide (Cu2O)1317-39-10.1751001.0000000.497585
DumetIron-nickel alloyCobalt (Co)7440-48-40.0875500.5000000.248792
DumetIron-nickel alloySilicon (Si)7440-21-30.0525300.3000000.149275
DumetIron-nickel alloyCarbon (C)7440-44-00.0262650.1500000.074638
DumetIron-nickel alloyPhosphorus (P)7723-14-00.0035020.0200000.009952
DumetIron-nickel alloySulfur (S)7704-34-90.0035020.0200000.009952
Dumet Total17.510000100.00000049.758454
Marking InkInkNon-declarable0.01398069.9000000.039727
Marking InkInkCarbon black1333-86-40.00427221.3600000.012140
Marking InkInkPhenol108-95-20.0017488.7400000.004967
Marking Ink Total0.020000100.0000000.056834
BZV55-B10 Total35.190000100.000000
Notes
Report created on 2025-05-06 15:24:46 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2025-05-06 15:24:46 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名稱
Material
有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
鉛 (Pb) 鎘 (Cd) 汞 (Hg) 六價鉻 (Cr6+) 多溴聯(lián)苯 (PBB) 多溴二苯醚 (PBDE)
半導(dǎo)體芯片 (Die)??????
半導(dǎo)體芯片金屬化層1 (Die Metallization 1)??????
半導(dǎo)體芯片金屬化層2 (Die Metallization 2)??????
半導(dǎo)體芯片金屬化層3 (Die Metallization 3)??????
后鍍層 (Post-Plating)??????
玻璃管 (Glass Tube)??????
杜美絲 (Dumet)??????
標(biāo)記墨水 (Marking Ink)??????
? 表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
? 表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
? 該半導(dǎo)體產(chǎn)品具有無限期的環(huán)保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2025-05-06 15:24:46 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
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