化學成分 MMBZ33VB-QB

作為一家積極進取的可持續(xù)發(fā)展公司，安世半導體已決定直接通過互聯(lián)網發(fā)布其產品組合的化學成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關資料，以協(xié)助他們進行RoHS指令或無鉛狀態(tài)合規(guī)評估。客戶可以直接從一般產品數據庫檢索中獲取這些詳細的數據，這是安世半導體為半導體產業(yè)設下的一個行業(yè)標準。安世半導體產品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934667594147	MMBZ33VB-QBZ	MMBZ33VB-QB	SOT8015 (DFN1110D-3)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 16657 ppm; substance 1333-86-4: 869 ppm; substance 7439-92-1: 1 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 16657 ppm; substance 1333-86-4: 869 ppm; substance 7439-92-1: 1 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 2825 ppm; substance 7440-05-3: 170 ppm; substance 7440-57-5: 6777 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Adhesive	Filler	Silver (Ag)	7440-22-4	0.004560	76.000000	0.282549
Adhesive	Polymer	Phenolic resin		0.000812	13.530000	0.050314
Adhesive	Polymer	Formaldehyde, polymer with (chloromethyl)oxirane and phenol	9003-36-5	0.000628	10.470000	0.038912
		Adhesive Total		0.006000	100.000000	0.371775

Die	Doped silicon	Silicon (Si)	7440-21-3	0.049000	100.000000	3.036161
		Die Total		0.049000	100.000000	3.036161

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	0.718807	95.586000	44.539061
Lead Frame	Copper alloy	Nickel (Ni)	7440-02-0	0.022416	2.980900	1.388951
Lead Frame	Copper alloy	Silicon (Si)	7440-21-3	0.004857	0.645900	0.300952
Lead Frame	Copper alloy	Magnesium (Mg)	7439-95-4	0.001120	0.149000	0.069398
		Base Alloy Total		0.747200	99.361800	46.298362
Lead Frame	Pure metal layer	Nickel (Ni)	7440-02-0	0.004467	0.594000	0.276786
		Pre-Plating 1 Total		0.004467	0.594000	0.276786
Lead Frame	Pure metal layer	Palladium (Pd)	7440-05-3	0.000275	0.036500	0.017040
		Pre-Plating 2 Total		0.000275	0.036500	0.017040
Lead Frame	Pure metal layer	Gold (Au)	7440-57-5	0.000058	0.007700	0.003594
		Pre-Plating 3 Total		0.000058	0.007700	0.003594
		Lead Frame Total		0.752000	100.000000	46.595782

Mould Compound	Filler	Silica fused	60676-86-0	0.636648	86.150000	39.448286
Mould Compound	Polymer	Epoxy resin system		0.064071	8.670000	3.969998
Mould Compound	Hardener	Phenolic resin		0.031703	4.290000	1.964396
Mould Compound	Additive	Non-declarable		0.003031	0.410000	0.187808
Mould Compound	Filler	Silica	7631-86-9	0.002143	0.290000	0.132786
Mould Compound	Pigment	Carbon black	1333-86-4	0.001404	0.190000	0.086995
		Mould Compound Total		0.739000	100.000000	45.790269

Post-Plating	Tin solder	Tin (Sn)	7440-31-5	0.056965	99.940000	3.529692
Post-Plating	Impurity	Non-declarable		0.000032	0.055500	0.001983
Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.000003	0.004500	0.000186
		Post-Plating Total		0.057000	100.000000	3.531861

Wire	Pure metal	Gold (Au)	7440-57-5	0.010879	99.990000	0.674090
Wire	Impurity	Non-declarable		0.000001	0.010000	0.000062
		Wire Total		0.010880	100.000000	0.674152

		MMBZ33VB-QB Total		1.613880		100.000000

Notes
Report created on 2025-04-22 11:31:57 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-04-22 11:31:57 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
膠黏劑 (Adhesive)	?	?	?	?	?	?
半導體芯片 (Die)	?	?	?	?	?	?
基底合金 (Base Alloy)	?	?	?	?	?	?
預鍍層1 (Pre-Plating 1)	?	?	?	?	?	?
預鍍層2 (Pre-Plating 2)	?	?	?	?	?	?
預鍍層3 (Pre-Plating 3)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
導線 (Wire)	?	?	?	?	?	?

?	表示該有害物質在該部件所有均質材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質至少在該部件的某一均質材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導體產品具有無限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-04-22 11:31:57 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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化學成分 MMBZ33VB-QB

雙極性晶體管

二極管

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MOSFET

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化學成分 MMBZ33VB-QB

ESD保護、TVS、濾波和信號調節(jié)ESD保護