化學(xué)成分 PMPB33XN

作為一家積極進取的可持續(xù)發(fā)展公司，安世半導(dǎo)體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關(guān)資料，以協(xié)助他們進行RoHS指令或無鉛狀態(tài)合規(guī)評估?？蛻艨梢灾苯訌囊话惝a(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細(xì)的數(shù)據(jù)，這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細(xì)資料請見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934066869115	PMPB33XN,115	PMPB33XN	SOT1220 (DFN2020MD-6)	DOD	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 24257 ppm; substance 1333-86-4: 2635 ppm; substance 7439-92-1: 1 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 24257 ppm; substance 1333-86-4: 2635 ppm; substance 7439-92-1: 1 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 7913 ppm; substance 7440-05-3: 1144 ppm; substance 7440-57-5: 8245 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Adhesive	Filler	Silver (Ag)	7440-22-4	0.056000	80.000000	0.791306
Adhesive	Polymer	Poly(isobornyl) methacrylate	64114-51-8	0.007000	10.000000	0.098913
Adhesive	Polymer	Bismaleimide resin		0.006125	8.750000	0.086549
Adhesive	Polymer	Polysiloxanes	63148-53-8	0.000700	1.000000	0.009892
Adhesive	Polymer	Acrylic resin		0.000168	0.240000	0.002374
Adhesive	Curing accelerators/Catalyst	Palladium (Pd)	7440-05-3	0.000007	0.010000	0.000099
		Adhesive Total		0.070000	100.000000	0.989133

Die	Doped silicon	Silicon (Si)	7440-21-3	0.159552	99.720000	2.254544
Die	Pure metal layer	Aluminium (Al)	7429-90-5	0.000448	0.280000	0.006330
		Die Metallization Total		0.000448	0.280000	0.006330
		Die Total		0.160000	100.000000	2.260874

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	2.686544	92.960000	37.962116
Lead Frame	Copper alloy	Nickel (Ni)	7440-02-0	0.083810	2.900000	1.184274
Lead Frame	Copper alloy	Silicon (Si)	7440-21-3	0.018207	0.630000	0.257273
Lead Frame	Copper alloy	Magnesium (Mg)	7439-95-4	0.004046	0.140000	0.057172
		Base Alloy Total		2.792607	96.630000	39.460835
Lead Frame	Pure metal layer	Nickel (Ni)	7440-02-0	0.087856	3.040000	1.241446
		Pre-Plating 1 Total		0.087856	3.040000	1.241446
Lead Frame	Pure metal layer	Palladium (Pd)	7440-05-3	0.008092	0.280000	0.114344
		Pre-Plating 2 Total		0.008092	0.280000	0.114344
Lead Frame	Pure metal layer	Gold (Au)	7440-57-5	0.001445	0.050000	0.020418
		Pre-Plating 3 Total		0.001445	0.050000	0.020418
		Lead Frame Total		2.890000	100.000000	40.837043

Mould Compound	Filler	Silica fused	60676-86-0	2.238000	60.000000	31.623981
Mould Compound	Filler	Silica	7631-86-9	0.857900	23.000000	12.122526
Mould Compound	Polymer	Epoxy resin system		0.261100	7.000000	3.689464
Mould Compound	Polymer	Phenolic resin		0.223800	6.000000	3.162398
Mould Compound	Flame retardant	Aluminium hydroxide (Al(OH)3)	21645-51-2	0.111900	3.000000	1.581199
Mould Compound	Ion trapping agent	Bismuth (Bi)	7440-69-9	0.018650	0.500000	0.263533
Mould Compound	Pigment	Carbon black	1333-86-4	0.018650	0.500000	0.263533
		Mould Compound Total		3.730000	100.000000	52.706634

Post-Plating	Tin solder	Tin (Sn)	7440-31-5	0.169898	99.940000	2.400738
Post-Plating	Impurity	Non-declarable		0.000094	0.055500	0.001328
Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.000008	0.004500	0.000113
		Post-Plating Total		0.170000	100.000000	2.402179

Wire 1	Pure metal	Gold (Au)	7440-57-5	0.050028	100.000000	0.706919
		Wire 1 Total		0.050028	100.000000	0.706919

Wire 2	Pure metal	Gold (Au)	7440-57-5	0.006879	99.990000	0.097204
Wire 2	Impurity	Non-declarable		0.000001	0.010000	0.000014
		Wire 2 Total		0.006880	100.000000	0.097218

		PMPB33XN Total		7.076908		100.000000

Notes
Report created on 2025-04-22 11:32:38 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-04-22 11:32:38 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
膠黏劑 (Adhesive)	?	?	?	?	?	?
半導(dǎo)體芯片 (Die)	?	?	?	?	?	?
半導(dǎo)體芯片金屬化層 (Die Metallization)	?	?	?	?	?	?
基底合金 (Base Alloy)	?	?	?	?	?	?
預(yù)鍍層1 (Pre-Plating 1)	?	?	?	?	?	?
預(yù)鍍層2 (Pre-Plating 2)	?	?	?	?	?	?
預(yù)鍍層3 (Pre-Plating 3)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
導(dǎo)線 (Wire)	?	?	?	?	?	?
導(dǎo)線 (Wire)	?	?	?	?	?	?

?	表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導(dǎo)體產(chǎn)品具有無限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-04-22 11:32:38 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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所有產(chǎn)品

雙極性晶體管

二極管

ESD保護、TVS、信號調(diào)節(jié)

MOSFET

SiC MOSFETs

氮化鎵場效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車

所有應(yīng)用

汽車

工業(yè)和電力

移動和可穿戴應(yīng)用

計算和消費電子

Sub-systems: Power conversion topologies

子系統(tǒng)

參考設(shè)計

評估板

Interactive application notes

Advanced Support Tools

化學(xué)成分 PMPB33XN

雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調(diào)節(jié)ESD保護

MOSFET

氮化鎵場效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

化學(xué)成分 PMPB33XN

ESD保護、TVS、濾波和信號調(diào)節(jié)ESD保護