化學成分 PNU650200AEJ-Q

作為一家積極進取的可持續(xù)發(fā)展公司，安世半導體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關資料，以協(xié)助他們進行RoHS指令或無鉛狀態(tài)合規(guī)評估。客戶可以直接從一般產(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細的數(shù)據(jù)，這是安世半導體為半導體產(chǎn)業(yè)設下的一個行業(yè)標準。安世半導體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934666001118	PNU650200AEJ-QJ	PNU650200AEJ-Q	SOT8018 (TO263-2L)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 5926 ppm of the article. SCIP No. f8fd1871-86a2-4364-a382-bb3e3e5c862c.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHS	Not compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7439-92-1: 5926 ppm; substance 7440-02-0: 171 ppm; substance 1333-86-4: 2060 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7439-92-1: 5926 ppm; substance 7440-02-0: 171 ppm; substance 1333-86-4: 2060 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 95 ppm;
RHF Indicator	Contains EU RoHS-exempted lead and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die	Doped silicon	Silicon (Si)	7440-21-3	2.573000	100.000000	0.168061
		Die Total		2.573000	100.000000	0.168061

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	872.263124	99.858400	56.973826
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	0.611450	0.070000	0.039938
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	0.218375	0.025000	0.014264
Lead Frame	Impurity	Lead (Pb)	7439-92-1	0.013976	0.001600	0.000913
		Base Alloy Total		873.106925	99.955000	57.028941
Lead Frame	Pure metal layer	Nickel (Ni)	7440-02-0	0.174700	0.020000	0.011411
		Pre-Plating 1 Total		0.174700	0.020000	0.011411
Lead Frame	Nickel alloy	Phosphorus (P)	7723-14-0	0.131025	0.015000	0.008558
Lead Frame	Nickel alloy	Nickel (Ni)	7440-02-0	0.087350	0.010000	0.005705
		Pre-Plating 2 Total		0.218375	0.025000	0.014263
		Lead Frame Total		873.500000	100.000000	57.054615

Mould Compound	Filler	Silica fused	60676-86-0	473.235000	75.000000	30.910408
Mould Compound	Filler	Silica	7631-86-9	94.647000	15.000000	6.182081
Mould Compound	Polymer	Epoxy resin system		47.323500	7.500000	3.091041
Mould Compound	Polymer	Phenolic resin		12.619600	2.000000	0.824278
Mould Compound	Pigment	Carbon black	1333-86-4	3.154900	0.500000	0.206069
		Mould Compound Total		630.980000	100.000000	41.213877

Post-Plating	Pure metal layer	Tin (Sn)	7440-31-5	8.679132	99.990000	0.566897
Post-Plating	Impurity	Non-declarable		0.000868	0.010000	0.000057
		Post-Plating Total		8.680000	100.000000	0.566954

Wire	Pure metal	Aluminium (Al)	7429-90-5	5.565540	99.990000	0.363526
Wire	Impurity	Nickel (Ni)	7440-02-0	0.000334	0.006000	0.000022
Wire	Impurity	Copper (Cu)	7440-50-8	0.000056	0.001000	0.000003
Wire	Impurity	Magnesium (Mg)	7439-95-4	0.000056	0.001000	0.000004
Wire	Impurity	Silicon (Si)	7440-21-3	0.000056	0.001000	0.000004
Wire	Impurity	Iron (Fe)	7439-89-6	0.000055	0.001000	0.000003
		Wire Total		5.566097	100.000000	0.363562

Chip Coat	Polymer	3-Aminopropyltrihydroxysilane	58160-99-9	0.000100	100.000000	0.000007
		Chip Coat Total		0.000100	100.000000	0.000007

Solder Wire	Lead alloy	Lead (Pb)	7439-92-1	9.060150	93.500000	0.591784
Solder Wire	Lead alloy	Tin (Sn)	7440-31-5	0.484500	5.000000	0.031646
Solder Wire	Lead alloy	Silver (Ag)	7440-22-4	0.145350	1.500000	0.009494
		Solder Wire Total		9.690000	100.000000	0.632924

		PNU650200AEJ-Q Total		1530.989197		100.000000

Notes
Report created on 2025-04-22 11:32:41 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
245 °C	40 s	220 °C	30 s	3

Notes
Report created on 2025-04-22 11:32:41 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
半導體芯片 (Die)	?	?	?	?	?	?
基底合金 (Base Alloy)	?	?	?	?	?	?
預鍍層1 (Pre-Plating 1)	?	?	?	?	?	?
預鍍層2 (Pre-Plating 2)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
導線 (Wire)	?	?	?	?	?	?
芯片涂層 (Chip Coat)	?	?	?	?	?	?
焊錫絲 (Solder Wire)	?	?	?	?	?	?

?	表示該有害物質在該部件所有均質材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質至少在該部件的某一均質材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導體產(chǎn)品具有無限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-04-22 11:32:41 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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化學成分 PNU650200AEJ-Q

雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調節(jié)ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產(chǎn)品(AEC-Q100/Q101)

化學成分 PNU650200AEJ-Q

ESD保護、TVS、濾波和信號調節(jié)ESD保護