化學(xué)成分 SMA6J26CA

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司，安世半導(dǎo)體已決定直接通過(guò)互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息，恩智浦可以向我們的客戶(hù)提供相關(guān)資料，以協(xié)助他們進(jìn)行RoHS指令或無(wú)鉛狀態(tài)合規(guī)評(píng)估?？蛻?hù)可以直接從一般產(chǎn)品數(shù)據(jù)庫(kù)檢索中獲取這些詳細(xì)的數(shù)據(jù)，這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個(gè)行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國(guó)RoHS。詳細(xì)資料請(qǐng)見(jiàn)限用物質(zhì)聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934668534118	SMA6J26CAJ	SMA6J26CA	SOD1001-1 (SMA)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 13948 ppm of the article. SCIP No. c5f6120f-1dc2-4279-8acc-cf614b14c39a.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'; using exemption 7(c)-I: 'Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound.'.
CN RoHS	Not compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'; using exemption 10(a): 'Electrical and electronic components, which contain lead in a glass or ceramic, in a glass or ceramic matrix compound, in a glass-ceramic material, or in a glass-ceramic matrix compound.'.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 65997-17-3: 138 ppm; substance 7440-02-0: 1575 ppm; substance 1333-86-4: 6587 ppm; substance 7439-92-1: 13948 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 65997-17-3: 138 ppm; substance 7440-02-0: 1575 ppm; substance 1333-86-4: 6587 ppm; substance 7439-92-1: 13948 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 377 ppm;
RHF Indicator	Contains EU RoHS-exempted lead and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die	Doped silicon	Silicon (Si)	7440-21-3	1.828649	90.180000	2.504999
Die	Lead borosilicate glass	Lead borosilicate glass (generic)	65997-17-3	0.010140	0.500000	0.013890
Die	Pure metal layer	Aluminium (Al)	7429-90-5	0.040349	1.990000	0.055273
		Die Metallization 1 Total		0.040349	1.990000	0.055273
Die	Pure metal layer	Titanium (Ti)	7440-32-6	0.033660	1.660000	0.046109
		Die Metallization 2 Total		0.033660	1.660000	0.046109
Die	Pure metal layer	Nickel (Ni)	7440-02-0	0.114980	5.670000	0.157507
		Die Metallization 3 Total		0.114980	5.670000	0.157507
		Die Total		2.027778	100.000000	2.777778

Clip	Copper alloy	Copper (Cu)	7440-50-8	5.555671	99.888000	7.610508
Clip	Copper alloy	Iron (Fe)	7439-89-6	0.004672	0.084000	0.006400
Clip	Copper alloy	Phosphorus (P)	7723-14-0	0.001562	0.028000	0.002140
		Clip Total		5.561905	100.000000	7.619048

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	15.046621	99.888000	20.611809
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	0.012651	0.084000	0.017330
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	0.004220	0.028000	0.005781
		Lead Frame Total		15.063492	100.000000	20.634920

Mould Compound	Filler	Silica fused	60676-86-0	41.835950	87.000000	57.309520
Mould Compound	Polymer	Epoxy resin system		1.442621	3.000000	1.976193
Mould Compound	Polymer	o-Cresol-epichlorohydrin-formaldehyde copolymer	29690-82-2	1.442621	3.000000	1.976193
Mould Compound	Polymer	Phenolic resin		1.442620	3.000000	1.976192
Mould Compound	Filler	Silica	7631-86-9	1.442620	3.000000	1.976192
Mould Compound	Pigment	Carbon black	1333-86-4	0.480870	1.000000	0.658726
		Mould Compound Total		48.087302	100.000000	65.873016

Post-Plating	Pure metal layer	Tin (Sn)	7440-31-5	1.158730	100.000000	1.587301
		Post-Plating Total		1.158730	100.000000	1.587301

Solder Paste	Lead alloy	Lead (Pb)	7439-92-1	1.018231	92.500000	1.394837
Solder Paste	Lead alloy	Tin (Sn)	7440-31-5	0.055042	5.000000	0.075400
Solder Paste	Lead alloy	Silver (Ag)	7440-22-4	0.027521	2.500000	0.037700
		Solder Paste Total		1.100794	100.000000	1.507937

		SMA6J26CA Total		73.000001		100.000000

Notes
Report created on 2025-04-22 11:32:58 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-04-22 11:32:58 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱(chēng) Material	有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
部件名稱(chēng) Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價(jià)鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
半導(dǎo)體芯片 (Die)	?	?	?	?	?	?
半導(dǎo)體芯片金屬化層1 (Die Metallization 1)	?	?	?	?	?	?
半導(dǎo)體芯片金屬化層2 (Die Metallization 2)	?	?	?	?	?	?
半導(dǎo)體芯片金屬化層3 (Die Metallization 3)	?	?	?	?	?	?
夾子 (Clip)	?	?	?	?	?	?
引線框架 (Lead Frame)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
錫膏 (Solder Paste)	?	?	?	?	?	?

?	表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導(dǎo)體產(chǎn)品具有無(wú)限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-04-22 11:32:58 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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化學(xué)成分 SMA6J26CA

雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

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化學(xué)成分 SMA6J26CA

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)