CBT3253
參數(shù)類型
| 型號 |
|---|
封裝
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| CBT3253D | CBT3253D,112 (935272583112) |
Obsolete | no package information | ||||
| CBT3253D,118 (935272583118) |
Obsolete | ||||||
| CBT3253DB | CBT3253DB,112 (935272581112) |
Obsolete | CT3253 |
SSOP16 (SOT338-1) |
SOT338-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暫無信息 |
| CBT3253DB,118 (935272581118) |
Obsolete | CT3253 | 暫無信息 | ||||
| CBT3253DS | CBT3253DS,112 (935272580112) |
Obsolete | CBT3253 According NX3-00133 According NX3-00133 |
SSOP16 (SOT519-1) |
SOT519-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暫無信息 |
| CBT3253DS,118 (935272580118) |
Obsolete | CBT3253 According NX3-00133 According NX3-00133 | SOT519-1_118 | ||||
| CBT3253PW | CBT3253PW,112 (935272579112) |
Obsolete | CBT3253 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
暫無信息 |
| CBT3253PW,118 (935272579118) |
Discontinued / End-of-life | CBT3253 | SOT403-1_118 | ||||
環(huán)境信息
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| CBT3253D | CBT3253D,112 | CBT3253D |
|
|
| CBT3253D | CBT3253D,118 | CBT3253D |
|
|
| CBT3253DB | CBT3253DB,112 | CBT3253DB |
|
|
| CBT3253DB | CBT3253DB,118 | CBT3253DB |
|
|
| CBT3253DS | CBT3253DS,112 | CBT3253DS |
|
|
| CBT3253DS | CBT3253DS,118 | CBT3253DS |
|
|
| CBT3253PW | CBT3253PW,112 | CBT3253PW |
|
|
| CBT3253PW | CBT3253PW,118 | CBT3253PW |
|
|
文檔 (13)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| CBT3253 | Dual 1-of-4 FET multiplexer/demultiplexer | Data sheet | 2024-04-18 |
| AN90010 | Pin FMEA for CBT(D) family | Application note | 2019-10-28 |
| SOT519-1 | 3D model for products with SOT519-1 package | Design support | 2023-02-07 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SSOP16_SOT338-1_mk | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT338-1 | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2022-06-20 |
| SOT519-1 | plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm body | Package information | 2022-06-20 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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