PBLS4003Y; PBLS4003V
參數(shù)類型
| 型號(hào) | Package version | Package name | Size (mm) | Polarity | Ptot [max] (mW) | VCEO [max] (V) | VCEsat [max] (mV) | VCEsat [max] (trans 2) (mV) | RCEsat@IC [max]; IC/IB =10 [typ] (mΩ) | hFE [min] | fT [typ] (MHz) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBLS4003Y | SOT363 | TSSOP6 | 2.1 x 1.25 x 0.95 | NPN/PNP | 300 | 50 | -150 | -350 | 440 | 30 | 100 | N |
封裝
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PBLS4003Y | PBLS4003Y,115 (934058646115) |
Active | S3% |
TSSOP6 (SOT363) |
SOT363 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT363_115 |
環(huán)境信息
品質(zhì)及可靠性免責(zé)聲明
文檔 (14)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| PBLS4003Y_PBLS4003V | 40 V PNP BISS loadswitch | Data sheet | 2009-02-18 |
| AN90032 | Low temperature soldering, application study | Application note | 2022-02-22 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| 001aab555 | Block diagram: 1PS66SB82, 1PS88SB82, BCM847BS, BCM847BV, BCM847DS, BCM856BS, BCM856DS, BCM857BS, BCM857BV, BCM857DS, PBLS1501V, PBLS1501Y, PBLS1502V, PBLS1502Y, PBLS4001V, PBLS4001Y, PBLS4002V, PBLS4002Y, PBLS4003V, PBLS4003Y, PBLS4004V, PBLS4004Y, PBLS4005V, PBLS4005Y, PBLS1503V, PBLS1503Y, PBLS1504V, PBLS1504Y, PEMD2, PEMH30, PIMD2, PMP4201G, PMP4201V, PMP4201Y, PMP4501G, PMP4501V, PMP4501Y, PMP5201G, PMP5201V, PMP5201Y, PMP5501G, PMP5501V, PMP5501Y, PUMD2, PUMH30 | Block diagram | 2009-11-04 |
| sym036 | Graphic symbol: PNP BISS loadswitch | Block diagram | 2009-11-04 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT363 | 3D model for products with SOT363 package | Design support | 2018-12-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP6_SOT363_mk | plastic, surface-mounted package; 6 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2017-01-28 |
| SOT363 | plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2.1 mm x 1.25 mm x 0.95 mm body | Package information | 2022-06-01 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| MAR_SOT363 | MAR_SOT363 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
如果您需要設(shè)計(jì)/技術(shù)支持，請(qǐng)告知我們并填寫 應(yīng)答表 我們會(huì)盡快回復(fù)您。
模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT363 | 3D model for products with SOT363 package | Design support | 2018-12-05 |
Ordering, pricing & availability
樣品
作為 Nexperia 的客戶，您可以通過我們的銷售機(jī)構(gòu)訂購樣品。
如果您沒有 Nexperia 的直接賬戶，我們的全球和地區(qū)分銷商網(wǎng)絡(luò)可為您提供 Nexperia 樣品支持。查看官方經(jīng)銷商列表。