PCMFxUSB3B
參數(shù)類型
| 型號 | Package version | Package name | Size (mm) | Configuration | Nr of lines | VRWM (V) (V) | Cd [typ] (pF) | IPPM [max] (A) | VESD (kV) (kV) |
|---|---|---|---|---|---|---|---|---|---|
| PCMF1USB3B | WLCSP5_2-1-2 | WLCSP5 | 0.77 x 1.17 x 0.57 | Bidirectional | 2 | 4 | 0.3 | 9.5 | 20 |
| PCMF2USB3B | WLCSP10_4-2-4 | WLCSP10 | 1.57 x 1.17 x 0.57 | Bidirectional | 4 | 4 | 0.3 | 9.5 | 20 |
| PCMF3USB3B | WLCSP15_6-3-6 | WLCSP15 | 2.37 x 1.17 x 0.57 | Bidirectional | 6 | 4 | 0.3 | 9.5 | 20 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PCMF1USB3B | PCMF1USB3B/CZ (934660288087) |
Active |
WLCSP5 (WLCSP5_2-1-2) |
WLCSP5_2-1-2 | 暫無信息 | ||
| PCMF2USB3B | PCMF2USB3B/CZ (934660287087) |
Active |
WLCSP10 (WLCSP10_4-2-4) |
WLCSP10_4-2-4 | WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087 | ||
| PCMF3USB3B | PCMF3USB3B/CZ (934660286087) |
Active |
WLCSP15 (WLCSP15_6-3-6) |
WLCSP15_6-3-6 | WLCSP15_PCMF_PESD3USB3X_PCMF3HDMI2X_087 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| PCMF1USB3B | PCMF1USB3B/CZ | PCMF1USB3B |
|
|
| PCMF2USB3B | PCMF2USB3B/CZ | PCMF2USB3B |
|
|
| PCMF3USB3B | PCMF3USB3B/CZ | PCMF3USB3B |
|
|
文檔 (10)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| PCMFXUSB3B_C_SER | Common-mode EMI filter for differential channels with integrated bidirectional ESD protection | Data sheet | 2019-01-29 |
| WLCSP5_2-1-2 | 3D model for products with WLCSP5_2-1-2 package | Design support | 2023-03-13 |
| WLCSP10_4-2-4 | 3D model for products with WLCSP10_4-2-4 package | Design support | 2023-03-13 |
| WLCSP15_6-3-6 | 3D model for products with WLCSP15_6-3-6 package | Design support | 2023-03-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| WLCSP5_2-1-2_mk | wafer level chip-size package; 5 bumps (2-1-2) | Marcom graphics | 2017-01-28 |
| WLCSP10_4-2-4_mk | wafer level chip-size package; 10 bumps (4-2-4) | Marcom graphics | 2017-01-28 |
| WLCSP5_2-1-2 | wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
| WLCSP10_4-2-4 | wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
| WLCSP15_6-3-6 | wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
支持
如果您需要設(shè)計/技術(shù)支持，請告知我們并填寫 應(yīng)答表 我們會盡快回復(fù)您。
模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| WLCSP5_2-1-2 | 3D model for products with WLCSP5_2-1-2 package | Design support | 2023-03-13 |
| WLCSP10_4-2-4 | 3D model for products with WLCSP10_4-2-4 package | Design support | 2023-03-13 |
| WLCSP15_6-3-6 | 3D model for products with WLCSP15_6-3-6 package | Design support | 2023-03-13 |
Ordering, pricing & availability
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