BC859; BC860
參數(shù)類型
| 型號 | Package version | Package name | Size (mm) | hFE [min] | hFE [max] | fT [min] (MHz) | Complement | IC [max] (mA) | Noise figure [max] (dB) | VCEO [max] (V) | Ptot [max] (mW) | Polarity |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC859B | SOT23 | SOT23 | 2.9 x 1.3 x 1 | 220 | 475 | 100 | BC849B | 100 | 4 | 30 | 250 | PNP |
| BC859C | SOT23 | SOT23 | 2.9 x 1.3 x 1 | 420 | 800 | 100 | BC849C | 100 | 4 | 30 | 250 | PNP |
| BC860B | SOT23 | SOT23 | 2.9 x 1.3 x 1 | 220 | 475 | 100 | BC850B | 100 | 4 | 45 | 250 | PNP |
| BC860C | SOT23 | SOT23 | 2.9 x 1.3 x 1 | 420 | 800 | 100 | BC850C | 100 | 4 | 45 | 250 | PNP |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| BC859B | BC859B,215 (933589820215) |
Active | 4B% |
(SOT23) |
SOT23 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT23_215 |
| BC859C | BC859C,215 (933628690215) |
Active | 4C% |
(SOT23) |
SOT23 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT23_215 |
| BC859C,235 (933628690235) |
Active | 4C% | SOT23_235 | ||||
| BC860B | BC860B,215 (933589850215) |
Active | 4F% |
(SOT23) |
SOT23 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT23_215 |
| BC860B,235 (933589850235) |
Active | 4F% | SOT23_235 | ||||
| BC860C | BC860C,215 (933628700215) |
Active | 4G% |
(SOT23) |
SOT23 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT23_215 |
| BC860C,235 (933628700235) |
Active | 4G% | SOT23_235 |
文檔 (10)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| BC859_BC860 | PNP general purpose transistors | Data sheet | 2025-04-14 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| SOT23 | 3D model for products with SOT23 package | Design support | 2019-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT23_mk | plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| LSYMTRA | Letter Symbols - Transistors; General | Other type | 1999-05-06 |
| SOT23 | plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body | Package information | 2022-10-12 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
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模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| SOT23 | 3D model for products with SOT23 package | Design support | 2019-01-22 |
樣品
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