外形圖
| 封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT8044D-1 | HWSON6 | Plastic thermal enhanced very very thin Small Outline package with side-wettable flanks, no leads; 6 terminals; 0.65 mm pitch; 2.0 mm x 2.0 mm x 0.75 mm body | MO-229 (JEDEC) | 2024-10-16 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT8044D-1 | Plastic thermal enhanced very very thin Small Outline package with side-wettable flanks,no leads; 6 terminals; 0.65 mm pitch; 2.0 mm x 2.0 mm x 0.75 mm body | Package information | 2025-03-18 |
| SOT8044D-1_328 | DFN2020-6; Reel dry pack for SMD, 7"; Q2/T3 product orientation | Packing information | 2025-04-09 |
采用此封裝的產(chǎn)品
Analog & Logic ICs
| 型號 | 描述 | 快速訪問 |
|---|---|---|
| NEX90215BGA-Q100 | 150 mA, 40 V ultra-low Iq (5.3 μA) low-dropout voltage regulator | |
| NEX90230BGA-Q100 | 300 mA, 40 V ultra-low Iq (5.3 μA) low-dropout voltage regulator | |
| NEX90230AGA-Q100 | 300 mA, 40 V ultra-low Iq (5.3 μA) low-dropout voltage regulator | |
| NEX90215AGA-Q100 | 150 mA, 40 V ultra-low Iq (5.3 μA) low-dropout voltage regulator |