可訂購(gòu)部件
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 訂購(gòu)代碼(12NC) | 封裝 | 從經(jīng)銷(xiāo)商處購(gòu)買(mǎi) |
|---|---|---|---|---|
| BAS40-04 | BAS40-04,215 | 933661850215 | SOT23 | 訂單產(chǎn)品 |
| BAS40-04 | BAS40-04,235 | 933661850235 | SOT23 | 訂單產(chǎn)品 |
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Click here for more informationBAS40-04
General-purpose dual Schottky diode
General-purpose dual Schottky diode in a small SOT23 Surface-Mounted Device (SMD) plastic package.
Alternatives
Features and benefits
High switching speed
Low leakage current
High breakdown voltage
Low capacitance
AEC-Q101 qualified
Applications
Ultra high-speed switching
Voltage clamping
參數(shù)類(lèi)型
| 型號(hào) | Package version | Package name | Size (mm) | VR [max] (V) | IF [max] (mA) | Configuration | VF [max] (mV) | Cd [max] (pF) | @VR (V) | IR [max] (μA) | @VR (V) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS40-04 | SOT23 | SOT23 | 2.9 x 1.3 x 1 | 40 | 120 | series connected | 500@IF=10mA | 5 | 0 | 1 | 30 | Y |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| BAS40-04 | BAS40-04,215 (933661850215) |
Active | 44% |
(SOT23) |
SOT23 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT23_215 |
| BAS40-04,235 (933661850235) |
Active | 44% | SOT23_235 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| BAS40-04 | BAS40-04,215 | BAS40-04 |
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| BAS40-04 | BAS40-04,235 | BAS40-04 |
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文檔 (13)
| 文件名稱 | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| BAS40-04 | General-purpose dual Schottky diode | Data sheet | 2024-11-08 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| SOT23 | 3D model for products with SOT23 package | Design support | 2019-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT23_mk | plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| SOT23 | plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body | Package information | 2022-10-12 |
| SOT23_215 | Reel pack for SMD, 7"; Q3/T4 product orientation | Packing information | 2025-01-20 |
| SOT23_235 | Reel pack for SMD, 11"; Q3/T4 product orientation | Packing information | 2020-06-01 |
| BAS40-04_Nexperia_Product_Quality | BAS40-04 Nexperia Product Quality | Quality document | 2019-05-20 |
| BAS40-04_Nexperia_Product_Reliability | BAS40-04 Nexperia Product Reliability | Quality document | 2024-04-22 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| BAS40-04 | BAS40-04 SPICE model | SPICE model | 2012-07-21 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
樣品
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How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.