可訂購部件
| 型號 | 可訂購的器件編號 | 訂購代碼(12NC) | 封裝 | 從經(jīng)銷商處購買 |
|---|---|---|---|---|
| PSMN1R9-40YSD | PSMN1R9-40YSDX | 934660733115 | SOT669 | 訂單產(chǎn)品 |
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Click here for more informationPSMN1R9-40YSD
N-channel 40 V, 1.9 mΩ, 200 A standard level MOSFET in LFPAK56 using NextPower-S3 Schottky-Plus technology
200 A, standard level gate drive N-channel enhancement mode MOSFET in 175 °C LFPAK56 package using advanced TrenchMOS Superjunction technology. This product has been designed and qualified for high performance power switching applications.
Features and benefits
200 A continuous ID(max) rating
Avalanche rated, 100% tested at IAS = 180 A
Strong SOA (linear-mode) rating
NextPower-S3 technology delivers 'superfast switching with soft body-diode recovery'
Low QRR, QG and QGD for high system efficiency and low EMI designs
Schottky-Plus body-diode with low VSD, low QRR, soft recovery and low IDSS leakage
High reliability LFPAK (Power SO8) package, with copper-clip and solder die attach, qualified to 175 °C
Exposed leads can be wave soldered, visual solder joint inspection and high quality solder joints
Low parasitic inductance and resistance
Applications
High-performance synchronous rectification
DC-to-DC converters
High performance and high efficiency server power supply
Brushless DC motor control
Battery protection
Load-switch and eFuse
Inrush management, hotswap
參數(shù)類型
| 型號 | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Release date |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PSMN1R9-40YSD | SOT669 | LFPAK56; Power-SO8 | Production | N | 1 | 40 | 1.9 | 175 | 200 | 8.2 | 57 | 194 | 27 | 3 | N | 4427 | 1115 | 2018-07-18 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PSMN1R9-40YSD | PSMN1R9-40YSDX (934660733115) |
Active | 1D9S40Y |
LFPAK56; Power-SO8 (SOT669) |
SOT669 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT669_115 |
文檔 (19)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| PSMN1R9-40YSD | N-channel 40 V, 1.9 mΩ, 200 A standard level MOSFET in LFPAK56 using NextPower-S3 Schottky-Plus technology | Data sheet | 2019-09-06 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| SOT669 | 3D model for products with SOT669 package | Design support | 2017-06-30 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| LFPAK56_POWER-SO8_SOT669_mk | plastic, single-ended surface-mounted package; 4 terminals; 4.9 mm x 4.45 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| PSMN1R9-40YSD_LTspice_V1 | PSMN1R9-40YSD Precision ElectroThermal (PET) LTspice model | PET SPICE model | 2024-08-07 |
| SOT669 | plastic, single-ended surface-mounted package; 4 terminals | Package information | 2025-03-20 |
| SOT669_115 | LFPAK56; Reel pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2022-05-10 |
| T9_SOT669_PSMN1R9-40YSD_Nexperia_Quality_Reliability_document | T9_SOT669_PSMN1R9-40YSD_Nexperia_Quality_Reliability_document | Quality document | 2025-02-26 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| PSMN1R9-40YSD | PSMN1R9-40YSD SPICE model | SPICE model | 2019-09-18 |
| TN00008 | Power MOSFET frequently asked questions and answers | Technical note | 2024-08-09 |
| CauerModel_PSMN1R9-40YSD | PSMN1R9-40YSD Cauer model | Thermal model | 2019-11-08 |
| FosterModel_PSMN1R9-40YSD | PSMN1R9-40YSD Foster model | Thermal model | 2019-11-08 |
| PSMN1R9-40YSD | PSMN1R9-40YSD RC thermal model | Thermal model | 2024-07-03 |
| PSMN1R9-40YSD | PSMN1R9-40YSD FloTherm model | Thermal model | 2019-11-06 |
| PSMN1R9-40YSD_Cauer | PSMN1R9-40YSD Cauer model | Thermal model | 2019-11-08 |
| PSMN1R9-40YSD_Foster | PSMN1R9-40YSD Foster model | Thermal model | 2019-11-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| PSMN1R9-40YSD_LTspice_V1 | PSMN1R9-40YSD Precision ElectroThermal (PET) LTspice model | PET SPICE model | 2024-08-07 |
| PSMN1R9-40YSD | PSMN1R9-40YSD SPICE model | SPICE model | 2019-09-18 |
| CauerModel_PSMN1R9-40YSD | PSMN1R9-40YSD Cauer model | Thermal model | 2019-11-08 |
| FosterModel_PSMN1R9-40YSD | PSMN1R9-40YSD Foster model | Thermal model | 2019-11-08 |
| PSMN1R9-40YSD | PSMN1R9-40YSD RC thermal model | Thermal model | 2024-07-03 |
| PSMN1R9-40YSD | PSMN1R9-40YSD FloTherm model | Thermal model | 2019-11-06 |
| PSMN1R9-40YSD_Cauer | PSMN1R9-40YSD Cauer model | Thermal model | 2019-11-08 |
| PSMN1R9-40YSD_Foster | PSMN1R9-40YSD Foster model | Thermal model | 2019-11-08 |
| SOT669 | 3D model for products with SOT669 package | Design support | 2017-06-30 |
訂購、定價與供貨
| 型號 | Orderable part number | Ordering code (12NC) | 狀態(tài) | 包裝 | Packing Quantity | 在線購買 |
|---|---|---|---|---|---|---|
| PSMN1R9-40YSD | PSMN1R9-40YSDX | 934660733115 | Active | SOT669_115 | 1,500 |
|
樣品
作為 Nexperia 的客戶，您可以通過我們的銷售機構(gòu)訂購樣品。
如果您沒有 Nexperia 的直接賬戶，我們的全球和地區(qū)分銷商網(wǎng)絡可為您提供 Nexperia 樣品支持。查看官方經(jīng)銷商列表。
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.