74HC112-Q100; 74HCT112-Q100
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HC112PW-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 17 | 66 | low | -40~125 | 109 | 1 | 36.7 | TSSOP16 |
| 74HCT112D-Q100 | 4.5?-?5.5 | TTL | ± 4 | 19 | 70 | low | -40~125 | 75 | 1.7 | 33 | SO16 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC112PW-Q100 | 74HC112PW-Q100J (935691580118) |
Active | HC112 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
| 74HCT112D-Q100 | 74HCT112D-Q100J (935691595118) |
Active | 74HCT112D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC112PW-Q100 | 74HC112PW-Q100J | 74HC112PW-Q100 |
|
|
| 74HCT112D-Q100 | 74HCT112D-Q100J | 74HCT112D-Q100 |
|
|
文檔 (13)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74HC_HCT112_Q100 | Dual JK flip-flop with set and reset; negative-edge trigger | Data sheet | 2024-01-15 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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