外形圖
| 封裝版本 | 封裝名稱(chēng) | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT1166-1 | DFN1714-8 | plastic, thermal enhanced ultra thin small outline package; 8 terminals; 0.4 mm pitch; 1.7 mm x 1.35 mm x 0.55 mm body | - - - (EIAJ); - - - (JEDEC) | 2010-03-22 |
相關(guān)文檔
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT1166-1 | plastic, thermal enhanced ultra thin small outline package; 8 terminals; 0.4 mm pitch; 1.7 mm x 1.35 mm x 0.55 mm body | Package information | 2025-01-29 |
采用此封裝的產(chǎn)品
ESD protection, TVS, filtering and signal conditioning
| 型號(hào) | 描述 | 快速訪問(wèn) |
|---|