外形圖
| 封裝版本 | 封裝名稱(chēng) | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT1255-2 | X2SON6 | plastic thermal enhanced extremely thin small outline package; no leads; 6 terminals; body 1.0 x 0.8 x 0.32 mm | 2019-11-08 |
相關(guān)文檔
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| SOT1255-2 | 3D model for products with SOT1255-2 package | Design support | 2021-01-28 |
| SOT1255-2 | plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
| SOT1255-2_147 | X2SON6; Reel pack for SMD, 7''; Q2/T3 product orientation | Packing information | 2020-05-08 |
采用此封裝的產(chǎn)品
Analog & Logic ICs
| 型號(hào) | 描述 | 快速訪(fǎng)問(wèn) |
|---|---|---|
| 74AUP1G157GX | Low-power 2-input multiplexer |
|