外形圖
| 封裝版本 | 封裝名稱(chēng) | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT353-1 | TSSOP5 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | SC-88A (EIAJ); MO-203 (JEDEC) | 2021-12-16 |
相關(guān)文檔
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| SOT353-1_125 | TSSOP5; Reel pack for SMD, 7"; Q3/T4 product orientation | Packing information | 2023-02-21 |
| SOT353-1_165 | TSSOP5; Reel pack; SMD; Q3 Reverse product orientation; Orderable part number ending, 165 or Z; Ordering code (12NC) ending 165 | Packing information | 2020-04-27 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
采用此封裝的產(chǎn)品
Analog & Logic ICs
| 型號(hào) | 描述 | 快速訪(fǎng)問(wèn) |
|---|---|---|
| 74LVC1G04GW | Single inverter |
|