外形圖
| 封裝版本 | 封裝名稱 | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT8063-2 | HSO8 | HSO8: Plastic, thermal enhanced small outline package; 8 leads; 1.27 mm pitch; 4.9 mm × 3.9 mm × 1.7 mm body | MS-012 (JEDEC) | 2025-04-09 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT8063-2 | HSO8: Plastic, thermal enhanced small outline package; 8 leads;1.27 mm pitch; 4.9 mm × 3.9 mm × 1.7 mm body | Package information | 2025-04-14 |
采用此封裝的產(chǎn)品
Analog & Logic ICs
| 型號(hào) | 描述 | 快速訪問(wèn) |
|---|---|---|
| NEX91530PB-Q100 | Automotive 300 mA, 40 V tracking LDO with 5 mV tolerance | |
| NEX91515PB-Q100 | Automotive 150 mA, 40 V tracking LDO with 5 mV tolerance | |
| NEX91615PB-Q100 | Automotive 150 mA, 40 V tracking LDO with 5 mV tolerance | |
| NEX91630PB-Q100 | Automotive 300 mA, 40 V tracking LDO with 5 mV tolerance |